ZTE Communications ›› 2026, Vol. 24 ›› Issue (3): 70-81.DOI: 10.12142/ZTECOM.202603009
• Industry-Academia Co-Research • Previous Articles Next Articles
Wang Yunfeng1, Xu Zhiyu2, Zhang Hongtao1(
)
Received:2024-12-13
Online:2026-09-01
Published:2026-09-20
About author:Wang Yunfeng received his bachelor’s degree in communication engineering from Beijing University of Posts and Telecommunications (BUPT), China in 2024. He is currently working toward a master's degree in communication and information engineering at the School of Artificial Intelligence, BUPT. His research interests include the emerging technologies of 5G wireless communication networks.Supported by:Wang Yunfeng, Xu Zhiyu, Zhang Hongtao. Reconfigurable Metasurface for Near-Field Efficient Wireless Power Transfer System[J]. ZTE Communications, 2026, 24(3): 70-81.
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URL: https://zte.magtechjournal.com/EN/10.12142/ZTECOM.202603009
Figure 4 Phase compensation and normalized electric-field distributions: (a) non-quantized compensation phase distribution; (b) 1-bit quantization; (c) 2-bit quantization; (d) 3-bit quantization; (e) 4-bit quantization; (f) non-quantized electric-field distribution (reference)
Figure 5 Normalized electric field distribution of different array sizes and focus distances: (a) 10 × 10 array at (0, 0, 1 m); (b) 10 × 10 array at (0, 0, 5 m); (c) 20 × 20 array at (0, 0, 1 m); (d) 20 × 20 array at (0, 0, 5 m); (e) 40 × 40 array at (0, 0, 1 m); (f) 40 × 40 array at (0, 0, 5 m)
| Geometric Parameters | Element dimensions and thickness | D = 25 mm | h1= 4 mm |
|---|---|---|---|
| h2 = 0.2 mm | hpp= 0.1 mm | ||
| Patch parameters | w1 = 0.9 mm | l1= 2.985 mm | |
| w2 = 0.5 mm | l2= 15 mm | ||
| Via dimensions | d1 = 0.6 mm | d2 = 1.6 mm | |
| Material Properties | Dielectric substrate | F4B material (with a relative permittivity of 2.65 and a loss tangent of 0.001 5) | |
| Adhesive material | Prepreg material (with a relative permittivity of 2.5 and a loss tangent of 0.004) | ||
Table 1 Geometric parameters and material properties of the unit design
| Geometric Parameters | Element dimensions and thickness | D = 25 mm | h1= 4 mm |
|---|---|---|---|
| h2 = 0.2 mm | hpp= 0.1 mm | ||
| Patch parameters | w1 = 0.9 mm | l1= 2.985 mm | |
| w2 = 0.5 mm | l2= 15 mm | ||
| Via dimensions | d1 = 0.6 mm | d2 = 1.6 mm | |
| Material Properties | Dielectric substrate | F4B material (with a relative permittivity of 2.65 and a loss tangent of 0.001 5) | |
| Adhesive material | Prepreg material (with a relative permittivity of 2.5 and a loss tangent of 0.004) | ||
| Encoded Value | Bias Voltage/V | Capacitance/pF | Resistance/Ω | Inductance/nH | Phase/deg |
|---|---|---|---|---|---|
| 000 | 9.60 | 0.150 | 0.88 | 0.02 | 124.41 |
| 001 | 4.56 | 0.330 | 0.88 | 0.02 | 79.64 |
| 010 | 4.08 | 0.368 | 0.88 | 0.02 | 33.85 |
| 011 | 3.70 | 0.376 | 0.88 | 0.02 | -7.42 |
| 100 | 3.32 | 0.408 | 0.88 | 0.02 | -62.63 |
| 101 | 2.94 | 0.430 | 0.88 | 0.02 | -110.79 |
| 110 | 2.12 | 0.460 | 0.88 | 0.02 | -157.71 |
| 111 | 0 | 0.950 | 0.88 | 0.02 | -190.30 |
Table 2. 3 -bit encoding correspondence table
| Encoded Value | Bias Voltage/V | Capacitance/pF | Resistance/Ω | Inductance/nH | Phase/deg |
|---|---|---|---|---|---|
| 000 | 9.60 | 0.150 | 0.88 | 0.02 | 124.41 |
| 001 | 4.56 | 0.330 | 0.88 | 0.02 | 79.64 |
| 010 | 4.08 | 0.368 | 0.88 | 0.02 | 33.85 |
| 011 | 3.70 | 0.376 | 0.88 | 0.02 | -7.42 |
| 100 | 3.32 | 0.408 | 0.88 | 0.02 | -62.63 |
| 101 | 2.94 | 0.430 | 0.88 | 0.02 | -110.79 |
| 110 | 2.12 | 0.460 | 0.88 | 0.02 | -157.71 |
| 111 | 0 | 0.950 | 0.88 | 0.02 | -190.30 |
Figure 14 Measured normalized electric field distributions with focusing distance (represented as z) set to 1 m (left column) and 3 m (right column): (a) focusing position at (0, 0, z) m; (b) focusing position at (-0.1, -0.1, z) m
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