ZTE Communications ›› 2019, Vol. 17 ›› Issue (1): 1-2.DOI: 10.12142/ZTECOM.201901001
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Editorial on Special Topic: Quality of Experience for Emerging Video Communications
Changwen CHEN, Tiesong ZHAO, Zhibo CHEN
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Online:2019-02-20
Published:2019-11-14
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About author:CHEN Changwen is currently Dean of School of Science and Engineering at the Chinese University of Hong Kong, Shenzhen, China. He also serves as Deputy Director of Peng Cheng Laboratory. He continues to serve as an Empire Innovation Professor of Computer Science and Engineering at the University at Buffalo, State University of New York, USA. He was Allen Henry Endow Chair Professor at the Florida Institute of Technology, USA from July 2003 to December 2007. He was on the faculty of Electrical and Computer Engineering at the University of Rochester, USA from 1992 to 1996 and on the faculty of Electrical and Computer Engineering at the University of Missouri-Columbia, USA from 1996 to 2003.
He was the Editor-in-Chief for IEEE Trans. Multimedia from January 2014 to December 2016. He also served as the Editor-in-Chief for IEEE Trans. Circuits and Systems for Video Technology from January 2006 to December 2009. He has been an Editor for several other major IEEE Transactions and Journals, including the Proceedings of IEEE, IEEE Journal of Selected Areas in Communications, and IEEE Journal of Emerging and Selected Topics in Circuits and Systems. He has served as Conference Chair for several major IEEE, ACM and SPIE conferences related to multimedia video communications and signal processing. His research has been supported by NSF, DARPA, Air Force, NASA, Whitaker Foundation, Microsoft, Intel, Kodak, Huawei, and Technicolor.
He received his B.S. from University of Science and Technology of China in 1983, M.S.E.E. from University of Southern California, USA in 1986, and Ph.D. from University of Illinois at Urbana-Champaign, USA in 1992. He and his students have received nine Best Paper Awards or Best Student Paper Awards over the past two decades. He has also received several research and professional achievement awards, including the Sigma Xi Excellence in Graduate Research Mentoring Award in 2003, Alexander von Humboldt Research Award in 2009, the University at Buffalo Exceptional Scholar—Sustained Achievement Award in 2012, and the State University of New York System Chancellor’s Award for Excellence in Scholarship and Creative Activities in 2016. He has been an IEEE Fellow since 2004 and an SPIE Fellow since 2007.|ZHAO Tiesong is currently a Minjiang Distinguished Professor with Fuzhou University, China. He received the B.S. degree in electrical engineering from the University of Science and Technology of China in 2006, and the Ph.D. degree in computer science from the City University of Hong Kong, China in 2011. From 2012 to 2015, he served as postdoc researchers in City University of Hong Kong, University of Waterloo, Canada and the University at Buffalo, State University of New York, USA, respectively. He has joined Fuzhou University since 2015. In 2017, he received the Fujian Science & Technology Award for Young Scientists. Since 2019, he has also been served as the AE of IET Electronics Letters. His research interests include multimedia signal processing, coding and transmission.|CHEN Zhibo received the B.Sc. and Ph.D. degrees from Department of Electrical Engineering, Tsinghua University, China in 1998 and 2003, respectively. He is now a professor in University of Science and Technology of China. Before that he worked with SONY and Thomson from 2003 to 2012. He was a principal scientist and research manager at Thomson Research & Innovation Department. His research interests include image and video compression, visual quality of experience assessment, immersive media computing, and intelligent media computing. He has more than 50 granted and over 100 filed EU and US patent applications, more than 80 publications. He is an IEEE senior member, member of IEEE Visual Signal Processing and Communications Committee, and member of IEEE Multimedia Communication Committee. He was an organization committee member of ICIP 2017 and ICME 2013, and served as a TPC member in IEEE ISCAS and IEEE VCIP.
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