ZTE Communications ›› 2020, Vol. 18 ›› Issue (3): 33-41.DOI: 10.12142/ZTECOM.202003006

• Special Topic • Previous Articles     Next Articles

Integrated 3D Fan-out Package of RF Microsystem and Antenna for 5G Communications

XIA Chenhui(), WANG Gang, WANG Bo, MING Xuefei   

  1. The 58th Research Institute of China Electronics Technology Group Corporation, Wuxi 214000, China
  • Received:2020-07-27 Online:2020-09-25 Published:2020-11-03
  • About author:XIA Chenhui (smartxvip@163.com) received the master’s degree from Nanjing University of Science and Technology, China. He joined China Electronics Technology Group Corporation (CETC) 58 in 2018 and has been engaged in the research of RF micro-electro-mechanical system and RF advanced packaging technology, among which the project group of “flexible Micro/Nano Reconfigurable Manufacturing Technology” won the second prize for scientific and technological progress. At present, his main interests focus on the integration of RF antennas and the integrated packaging technology of heterogeneous chip microsystems. He has published four papers.|WANG Gang received the doctor’s degree from Beijing Institute of Technology, China. He joined CETC 58 in 2019 and has been engaged in RF MEMS and micro-system technology research. His current interests include sensor integration and 3D heterogeneous integration technology research. He has published 7 EI and SCI papers.|WANG Bo received the master’s degree from University of Electronic Science and Technology of China in 2008. He joined CETC 58 in 2017 and has been engaged in the research and development of wafer-level packaging and fan-out integration technology.|MING Xuefei received the master’s degree from The Hong Kong University of Science and Technology, China. Since 2010, he has joined CETC 58, mainly engaged in advanced packaging research work. Ten papers were published, two of which were searched by EI, and won the Science and Technology Progress Award of the Group and the State Administration of Science, Technology and Industry for National Defense for three times.


A 3D fan-out packaging method for the integration of 5G communication RF microsystem and antenna is studied. First of all, through the double-sided wiring technology on the glass wafer, the fabrication of 5G antenna array is realized. Then the low power devices such as through silicon via (TSV) transfer chips, filters and antenna tuners are flip-welded on the glass wafer, and the glass wafer is reformed into a wafer permanently bonded with glass and resin by the injection molding process with resin material. Finally, the thinning resin surface leaks out of the TSV transfer chip, the rewiring is carried out on the resin surface, and then the power amplifier, low-noise amplifier, power management and other devices are flip-welded on the resin wafer surface. A ball grid array (BGA) is implanted to form the final package. The loss of the RF transmission line is measured by using the RF millimeter wave probe table. The results show that the RF transmission loss from the chip end to the antenna end in the fan-out package is very small, and it is only 0.26 dB/mm when working in 60 GHz. A slot coupling antenna is designed on the glass wafer. The antenna can operate at 60 GHz and the maximum gain can reach 6 dB within the working bandwidth. This demonstration successfully provides a feasible solution for the 3D fan-out integration of RF microsystem and antenna in 5G communications.

Key words: AiP, fan?out package, RF microsystem, 3D integration, 5G communications