This paper reviews the state-of-the-art filter designs for 60 GHz applications. The most promising filter solutions at this frequency include filter-in-package where the filter itself is design in the packaging platform and filter-on-chip which is an on-chip filter codesign for miniaturized system size with low packaging cost. Design methodology, design technology, key performance parameters, similarities and differences, advantages and drawbacks, and future trends are explored and studied. Filters in the printed circuit board (PCB), low temperature co-fired ceramics (LTCC), organic material, and bipolar complementary metal oxide semiconductor (BiCMOS) chips are summarized and compared in details. Future design trends and challenges are also given after the review.